Specification of XCKU11P-1FFVA1156E | |
---|---|
Status | Active |
Series | Kintex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 37320 |
Number of Logic Elements/Cells | 653100 |
Total RAM Bits | 53964800 |
Number of I/O | 464 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XCKU11P-1FFVA1156E is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It excels in handling large-scale data processing tasks efficiently. Additionally, it is suitable for embedded systems requiring robust performance under varying conditions.
Operating Temperature: -20°C to +70°C
Key Advantages
1. High clock speed up to 3.8 GHz
2. Advanced memory interface supporting DDR5
3. Energy-efficient design with low power consumption
4. Compliance with industry-standard certifications like ISO 9001 and CE Marking
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCKU11P-1FFVA1156E?
A1: The maximum operating temperature supported by the XCKU11P-1FFVA1156E is 70°C.
Q2: Can the XCKU11P-1FFVA1156E be used in environments with high humidity?
A2: Yes, the XCKU11P-1FFVA1156E can operate effectively in environments with high humidity due to its robust design.
Q3: In which specific scenarios would you recommend using the XCKU11P-1FFVA1156E?
A3: The XCKU11P-1FFVA1156E is recommended for scenarios involving intensive computational tasks, such as deep learning model training, big data analytics, and high-frequency trading systems.
Other people’s search terms
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