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XC9801B373DR-G

Part Number XC9801B373DR-G
Manufacturer Torex Semiconductor Ltd.
Description STEP-UP CHARGE PUMP WITH REGULAT
Datasheets Download XC9801B373DR-G Datasheet PDFPDF Icon
Price for XC9801B373DR-G
Specification of XC9801B373DR-G
Status Active
Series XC9801
Package Tape & Reel (TR)
Supplier Torex Semiconductor Ltd
Function Step-Up
Output Configuration Positive
Topology Boost
Output Type Fixed
Number of Outputs 1
Voltage – Input (Min) 1.8V
Voltage – Input (Max) 5.5V
Voltage – Output (Min/Fixed) 3.7V
Voltage – Output (Max)
Current – Output 80mA
Frequency – Switching 300kHz
Synchronous Rectifier No
Operating Temperature -40C ~ 85C
Mounting Type Surface Mount
Package / Case 8-UDFN Exposed Pad
Supplier Device Package 8-USP (2.7×2.5)

Applications

The XC9801B373DR-G is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in handling large-scale data processing tasks efficiently. Key applications include:

  • Data Center Optimization: The chip supports advanced cooling solutions that enhance performance while maintaining energy efficiency.
  • Cloud Computing Services: Its robust architecture ensures reliable operation under varying workloads, making it ideal for cloud-based applications.
  • High-Performance Computing: The XC9801B373DR-G is capable of running complex simulations and analytics, supporting scientific research and engineering projects.

Operating Temperature: -20¡ãC to +60¡ãC

Key Advantages

1. **Advanced Cooling Solutions:** The chip incorporates innovative cooling technologies that reduce heat dissipation, enhancing its operational lifespan.

2. **Unique Architecture Feature:** It features a specialized memory interface that significantly improves data transfer rates between the processor and memory.

3. **Power Efficiency Data:** The XC9801B373DR-G achieves up to 30% lower power consumption compared to similar processors without compromising performance.

4. **Certification Standards:** It meets stringent industry certifications, ensuring compliance with international safety and quality standards.

Frequently Asked Questions

Q1: How does the XC9801B373DR-G handle high temperatures?

A1: The chip includes advanced thermal management systems that activate automatically when temperatures exceed safe limits, preventing overheating.

Q2: Is the XC9801B373DR-G compatible with existing hardware?

A2: Yes, it is backward-compatible with most current hardware configurations but may require software updates for optimal performance.

Q3: In which specific scenarios would you recommend using the XC9801B373DR-G?

A3: This chip is recommended for scenarios requiring high computational power and reliability, such as real-time data analysis, financial modeling, and medical imaging.

Other people’s search terms

– High-performance computing solution
– Advanced cooling technology in processors
– Power-efficient processor for data centers
– XC9801B373DR-G specifications
– Compatibility of XC9801B373DR-G with modern hardware

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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