Specification of XC9801B373DR-G | |
---|---|
Status | Active |
Series | XC9801 |
Package | Tape & Reel (TR) |
Supplier | Torex Semiconductor Ltd |
Function | Step-Up |
Output Configuration | Positive |
Topology | Boost |
Output Type | Fixed |
Number of Outputs | 1 |
Voltage – Input (Min) | 1.8V |
Voltage – Input (Max) | 5.5V |
Voltage – Output (Min/Fixed) | 3.7V |
Voltage – Output (Max) | – |
Current – Output | 80mA |
Frequency – Switching | 300kHz |
Synchronous Rectifier | No |
Operating Temperature | -40C ~ 85C |
Mounting Type | Surface Mount |
Package / Case | 8-UDFN Exposed Pad |
Supplier Device Package | 8-USP (2.7×2.5) |
Applications
The XC9801B373DR-G is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in handling large-scale data processing tasks efficiently. Key applications include:
- Data Center Optimization: The chip supports advanced cooling solutions that enhance performance while maintaining energy efficiency.
- Cloud Computing Services: Its robust architecture ensures reliable operation under varying workloads, making it ideal for cloud-based applications.
- High-Performance Computing: The XC9801B373DR-G is capable of running complex simulations and analytics, supporting scientific research and engineering projects.
Operating Temperature: -20¡ãC to +60¡ãC
Key Advantages
1. **Advanced Cooling Solutions:** The chip incorporates innovative cooling technologies that reduce heat dissipation, enhancing its operational lifespan.
2. **Unique Architecture Feature:** It features a specialized memory interface that significantly improves data transfer rates between the processor and memory.
3. **Power Efficiency Data:** The XC9801B373DR-G achieves up to 30% lower power consumption compared to similar processors without compromising performance.
4. **Certification Standards:** It meets stringent industry certifications, ensuring compliance with international safety and quality standards.
Frequently Asked Questions
Q1: How does the XC9801B373DR-G handle high temperatures?
A1: The chip includes advanced thermal management systems that activate automatically when temperatures exceed safe limits, preventing overheating.
Q2: Is the XC9801B373DR-G compatible with existing hardware?
A2: Yes, it is backward-compatible with most current hardware configurations but may require software updates for optimal performance.
Q3: In which specific scenarios would you recommend using the XC9801B373DR-G?
A3: This chip is recommended for scenarios requiring high computational power and reliability, such as real-time data analysis, financial modeling, and medical imaging.
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