Specification of XC7Z045-L2FFG676I | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z045-L2FFG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 667 MHz, providing fast processing performance.
2. Advanced memory interface supporting DDR3 SDRAM, enhancing data throughput.
3. Low power consumption, reducing operational costs significantly.
4. Compliant with multiple industry certifications ensuring reliability and safety.
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XC7Z045-L2FFG676I?
A1: The maximum operating temperature of the XC7Z045-L2FFG676I is +85°C.
Q2: Can the XC7Z045-L2FFG676I be used in conjunction with other components?
A2: Yes, the XC7Z045-L2FFG676I can be integrated with various other components through its advanced interconnectivity features.
Q3: In which specific scenarios would you recommend using the XC7Z045-L2FFG676I?
A3: The XC7Z045-L2FFG676I is recommended for scenarios requiring high-speed data processing and low-power operation, such as in embedded systems and mobile devices.
Other people’s search terms
– High-performance computing solutions
– DDR3 SDRAM support
– Industrial-grade temperature range
– Low power consumption FPGA
– Cloud computing hardware