| Specification of XC7Z045-3FFG676E | |
|---|---|
| Status | Active |
| Series | Zynq?-7000 |
| Package | Tray |
| Supplier | AMD |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Flash Size | – |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1GHz |
| Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z045-3FFG676E is ideal for high-performance computing environments due to its robust processing capabilities. It excels in data centers where it handles large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring reliable performance under varying conditions, such as in advanced driver assistance systems.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC7Z045-3FFG676E be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: Is there any specific software requirement for this chip?
A2: The chip supports standard industry software development tools and requires no proprietary software installation.
Q3: In which specific scenarios would you recommend using this XC7Z045-3FFG676E?
A3: This chip is recommended for scenarios involving real-time data analysis, such as financial market predictions and medical imaging processing.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Robust data center components
– Low-power high-speed processors
– Industry-standard certifications
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