Specification of XC7Z045-2FFG676I | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z045-2FFG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and scientific research projects that require extensive computational power. This device operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 667 MHz, providing fast processing performance.
2. Advanced memory interface supporting DDR3 SDRAM, enhancing data transfer rates.
3. Low power consumption, reducing operational costs and energy usage.
4. Compliance with multiple certification standards including CE, FCC, and RoHS.
Frequently Asked Questions
Q1: Can the XC7Z045-2FFG676I be used in extreme temperature conditions?
A1: Yes, it can operate effectively between -40°C and +85°C, ensuring reliability in diverse environments.
Q2: What kind of memory does it support?
A2: The XC7Z045-2FFG676I supports DDR3 SDRAM, which significantly boosts its data handling capacity.
Q3: In which specific scenarios would this XC7Z045-2FFG676I be most beneficial?
A3: This device is particularly beneficial in large-scale data processing tasks, such as big data analytics and machine learning algorithms, where high-speed and efficient computation are crucial.
Other people’s search terms
– High-performance computing solutions
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