| Specification of XC7Z045-2FBG676I | |
|---|---|
| Status | Active |
| Series | Zynq?-7000 |
| Package | Tray |
| Supplier | AMD |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Flash Size | – |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
| Operating Temperature | -40C ~ 100C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z045-2FBG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in data centers where it handles large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W per core at 25°C
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC7Z045-2FBG676I operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, ensuring reliability across various environmental conditions.
Q2: Is the XC7Z045-2FBG676I compatible with existing systems?
A2: The XC7Z045-2FBG676I is backward-compatible with most existing systems, but specific drivers may need updating for optimal performance.
Q3: In which specific scenarios would you recommend using the XC7Z045-2FBG676I?
A3: This chip is recommended for scenarios involving real-time data analysis, such as financial market predictions and autonomous vehicle navigation systems.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Robust data center components
– Low-power embedded systems
– Industrial-grade processors
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