Specification of XC7Z045-1FBG676I | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z045-1FBG676I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 500 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 RAM for faster data transfer rates.
3. Energy-efficient design with low power consumption, reducing operational costs.
4. Compliant with multiple industry certifications including ISO 9001 and CE marking.
Frequently Asked Questions
Q1: Can the XC7Z045-1FBG676I be used in high-temperature environments?
A1: Yes, it can operate effectively between -40°C and +85°C, making it suitable for industrial applications requiring robust performance at extreme temperatures.
Q2: What kind of memory does the XC7Z045-1FBG676I support?
A2: The XC7Z045-1FBG676I supports DDR4 memory, which enhances its ability to handle large datasets efficiently.
Q3: In which specific scenarios would you recommend using the XC7Z045-1FBG676I?
A3: The XC7Z045-1FBG676I is recommended for scenarios involving complex data processing tasks, such as machine learning model training and real-time data analysis in financial markets.
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