Specification of XC7Z035-3FFG900E | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex-7 FPGA, 275K Logic Cells |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31×31) |
Applications
The XC7Z035-3FFG900E is ideal for high-performance computing environments due to its robust processing capabilities. It excels in data centers where it handles large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W per core at 600MHz
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC7Z035-3FFG900E operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, ensuring reliability across various environmental conditions.
Q2: What are the compatibility requirements for the XC7Z035-3FFG900E?
A2: The XC7Z035-3FFG900E is compatible with a variety of operating systems and software platforms, making it versatile for different application needs.
Q3: In which specific scenarios would you recommend using the XC7Z035-3FFG900E?
A3: This chip is recommended for scenarios involving complex computational tasks such as machine learning algorithms, big data analytics, and real-time signal processing in industrial automation.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Robust data center components
– Low-power embedded systems
– Industrial automation processors