XC7Z035-1FBG676C

Applications

The XC7Z035-1FBG676C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various climates.

Key Advantages

1. High clock speed up to 100 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 RAM for faster data transfer rates.

3. Energy-efficient design with low power consumption, reducing operational costs.

4. Meets stringent industrial standards including CE, FCC, and RoHS certifications.

Frequently Asked Questions

Q1: Can the XC7Z035-1FBG676C be used in extreme temperature conditions?

A1: Yes, it can operate effectively between -40°C and +85°C, making it suitable for both cold and hot environments.

Q2: Is there any specific hardware requirement when using this chip?

A2: The XC7Z035-1FBG676C requires a compatible motherboard that supports its high-speed memory interface and power requirements.

Q3: In which industries does this chip find application?

A3: This chip finds applications in sectors like telecommunications, automotive electronics, and medical devices, where high performance and reliability are crucial.

Other people’s search terms

– High-performance computing solutions

– Industrial-grade FPGA chips

– Low-power FPGA technology

– DDR4 support in FPGAs

– Temperature-resistant FPGA devices