Specification of XC7Z030-2FBG676I | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex-7 FPGA, 125K Logic Cells |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z030-2FBG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in data centers where it handles large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W per core at 25°C
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC7Z030-2FBG676I operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: What certifications does the XC7Z030-2FBG676I have?
A2: The XC7Z030-2FBG676I has been certified according to CE, FCC, and RoHS standards, ensuring compliance with international regulations.
Q3: In which specific scenarios is the XC7Z030-2FBG676I particularly useful?
A3: This chip is particularly useful in high-performance computing environments such as cloud servers and automotive systems that require consistent and powerful processing capabilities.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Robust temperature operation
– Efficient power consumption
– Certified processor modules