| Specification of XC7Z030-2FBG676E | |
|---|---|
| Status | Active |
| Series | Zynq?-7000 |
| Package | Tray |
| Supplier | AMD |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Flash Size | – |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex-7 FPGA, 125K Logic Cells |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7Z030-2FBG676E is ideal for high-performance computing environments due to its robust processing capabilities. It excels in data centers where it handles large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC7Z030-2FBG676E be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: Is there any specific software requirement for this chip?
A2: The chip supports standard software development tools like Vivado and ISE, ensuring compatibility with existing design flows.
Q3: In which specific scenarios would you recommend using this XC7Z030-2FBG676E?
A3: This chip is recommended for applications that require high computational power and reliability, such as cloud computing services and advanced automotive systems.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Robust data center components
– Efficient parallel processing chips
– Reliable embedded systems processors
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