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XC7Z030-1FBG676I

Part Number XC7Z030-1FBG676I
Manufacturer Xilinx
Description IC SOC CORTEX-A9 667MHZ 676FCBGA
Price for XC7Z030-1FBG676I
Specification of XC7Z030-1FBG676I
Status Active
Series Zynq?-7000
Package Tray
Supplier AMD
Architecture MCU, FPGA
Core Processor Dual ARM Cortex-A9 MPCore with CoreSight
Flash Size
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex-7 FPGA, 125K Logic Cells
Operating Temperature -40C ~ 100C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27×27)

Applications

The XC7Z030-1FBG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various climates.

Key Advantages

1. High clock speed up to 667 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR3 SDRAM, enhancing data throughput.

3. Low power consumption, reducing operational costs significantly.

4. Compliant with multiple industry certifications including CE, FCC, and RoHS.

Frequently Asked Questions

Q1: Can the XC7Z030-1FBG676I be used in high-temperature environments?

A1: Yes, it can operate effectively between -40°C and +85°C, making it suitable for both indoor and outdoor applications.

Q2: What kind of memory does the XC7Z030-1FBG676I support?

A2: The XC7Z030-1FBG676I supports DDR3 SDRAM, which allows for efficient data handling and storage operations.

Q3: In which specific scenarios would you recommend using the XC7Z030-1FBG676I?

A3: The XC7Z030-1FBG676I is recommended for scenarios requiring high-speed data processing, such as real-time analytics, machine learning algorithms, and high-frequency trading systems.

Other people’s search terms

– High-performance computing solutions

– DDR3 SDRAM support devices

– Low-power FPGA processors

– Industry-standard certified FPGAs

– Temperature-resistant computing components

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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