XC7Z030-1FBG676C

Applications

The XC7Z030-1FBG676C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various climates.

Key Advantages

1. High clock speed up to 667 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR3 SDRAM, enhancing data throughput.

3. Low power consumption, reducing operational costs significantly.

4. Compliant with multiple industry certifications including CE, FCC, and RoHS.

Frequently Asked Questions

Q1: What is the maximum operating temperature for the XC7Z030-1FBG676C?

A1: The maximum operating temperature for the XC7Z030-1FBG676C is +85°C.

Q2: Can the XC7Z030-1FBG676C be used in conjunction with other components?

A2: Yes, it can be integrated with various other components through its versatile I/O interfaces and support for multiple communication protocols.

Q3: In which specific scenarios would you recommend using the XC7Z030-1FBG676C?

A3: The XC7Z030-1FBG676C is recommended for scenarios requiring high-speed data processing and low-latency operations, such as real-time analytics and high-frequency trading systems.

Other people’s search terms

– High-performance computing solutions

– DDR3 SDRAM support devices

– Low-power FPGA solutions

– Industry-standard certified FPGAs

– Artificial Intelligence hardware accelerators