Specification of XC7Z010-2CLG225I | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 766MHz |
Primary Attributes | Artix-7 FPGA, 28K Logic Cells |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 225-LFBGA, CSPBGA |
Supplier Device Package | 225-CSPBGA (13×13) |
Applications
The XC7Z010-2CLG225I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 667 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR3 SDRAM, enhancing data throughput.
3. Low power consumption per gigaflop, reducing operational costs significantly.
4. Compliance with multiple industry certifications ensuring reliability and safety.
Frequently Asked Questions
Q1: Can the XC7Z010-2CLG225I be used in extreme temperature conditions?
A1: Yes, it operates within a wide temperature range (-40°C to +85°C), making it suitable for harsh environments.
Q2: What kind of memory does it support?
A2: The XC7Z010-2CLG225I supports DDR3 SDRAM, which is essential for high-speed data processing.
Q3: In which specific scenarios would this XC7Z010-2CLG225I be most beneficial?
A3: This device is particularly beneficial in scenarios requiring high computational power and low latency, such as real-time analytics and AI applications.
Other people’s search terms
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