Specification of XC7VX415T-3FFG1157E | |
---|---|
Status | Active |
Series | Virtex?-7 XT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 32200 |
Number of Logic Elements/Cells | 412160 |
Total RAM Bits | 32440320 |
Number of I/O | 600 |
Number of Gates | – |
Voltage – Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1157-FCBGA (35×35) |
Applications
The XC7VX415T-3FFG1157E is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This FPGA supports operations at temperatures ranging from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High-speed data processing with a maximum clock frequency up to 600 MHz.
2. Advanced parallel processing architecture that enhances computational throughput.
3. Low power consumption, achieving less than 1 W per gigabit of memory bandwidth.
4. Compliance with industry-standard certifications like ISO 9001 and CE marking.
Frequently Asked Questions
Q1: Can the XC7VX415T-3FFG1157E be used in high-temperature environments?
A1: Yes, it operates effectively within a temperature range of -40¡ãC to +85¡ãC, making it suitable for industrial and military applications.
Q2: What are the compatibility requirements for the XC7VX415T-3FFG1157E?
A2: The XC7VX415T-3FFG1157E is compatible with standard JTAG interfaces and can interface with various third-party IP cores through its extensive I/O pins.
Q3: In which specific scenarios would you recommend using the XC7VX415T-3FFG1157E?
A3: The XC7VX415T-3FFG1157E is recommended for scenarios requiring high-speed data processing and low-power consumption, such as real-time signal processing in telecommunications and embedded systems.
Other people’s search terms
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