Specification of XC7VX415T-1FFG1157C | |
---|---|
Status | Active |
Series | Virtex?-7 XT |
Package | Tray |
Voltage – Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | 0¡ãC ~ 85¡ãC (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1157-FCBGA (35×35) |
Number of LABs/CLBs | 32200 |
Number of Logic Elements/Cells | 412160 |
Total RAM Bits | 32440320 |
Number of I/O | 600 |
Applications
The XC7VX415T-1FFG1157C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 600 MHz, enabling faster processing tasks.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s.
3. Energy-efficient design with power consumption optimized for extended operation.
4. Meets stringent industrial certification standards including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can this device be used in extreme temperature environments?
A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for harsh environments like industrial settings and outdoor deployments.
Q2: What are the specific memory interfaces supported by this device?
A2: The XC7VX415T-1FFG1157C supports DDR4 memory interfaces with speeds up to 2666 MT/s, enhancing data transfer rates significantly.
Q3: In which industries is this device commonly used?
A3: Commonly used in telecommunications, automotive electronics, and aerospace sectors where high performance and reliability are paramount.
Other people’s search terms
– High-speed processing solutions
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– DDR4 memory support FPGAs
– Energy-efficient FPGA architectures
– Certificated industrial FPGA modules