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XC7VX330T-1FFG1157C

Part Number XC7VX330T-1FFG1157C
Manufacturer Xilinx
Description IC FPGA 600 I/O 1157FCBGA
Price for XC7VX330T-1FFG1157C
Specification of XC7VX330T-1FFG1157C
Status Active
Series Virtex?-7 XT
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 25500
Number of Logic Elements/Cells 326400
Total RAM Bits 27648000
Number of I/O 600
Number of Gates
Voltage – Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1157-FCBGA (35×35)

Applications

The XC7VX330T-1FFG1157C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in fields such as artificial intelligence, machine learning, and big data analytics, offering fast execution speeds and efficient resource utilization.

In the automotive industry, it supports advanced driver assistance systems (ADAS) and autonomous driving features, enhancing safety and performance through real-time data processing.

For industrial automation, it enables complex control systems that require precise timing and high-speed data transfer, making it suitable for manufacturing processes that demand reliability and accuracy.

Operating Temperature: -40°C to +85°C

Key Advantages

1. High Processing Speed: The XC7VX330T-1FFG1157C boasts a maximum operating frequency of up to 667 MHz, enabling rapid data processing and handling large volumes of information efficiently.

2. Advanced Architecture: Featuring a unique multi-core processor design, it provides enhanced parallel processing capabilities, which significantly boosts computational power compared to traditional single-core processors.

3. Low Power Consumption: With integrated power management features, it consumes less energy while maintaining high performance levels, making it suitable for battery-operated devices and energy-efficient systems.

4. Industry Certifications: This chip has been certified to meet stringent industry standards, ensuring compliance with international regulations and quality assurance requirements.

Frequently Asked Questions

Q1: Can the XC7VX330T-1FFG1157C be used in low-power applications?

A1: Yes, despite its high processing speed, the XC7VX330T-1FFG1157C includes power-saving modes that allow it to operate at lower voltages and frequencies when necessary, making it suitable for low-power applications.

Q2: Is this chip compatible with existing hardware?

A2: The XC7VX330T-1FFG1157C is backward-compatible with most existing hardware interfaces, but specific drivers may need to be updated or new software configurations might be required for optimal performance.

Q3: In which specific scenarios would you recommend using the XC7VX330T-1FFG1157C?

A3: The XC7VX330T-1FFG1157C is recommended for scenarios requiring high-speed data processing, such as real-time signal processing in telecommunications networks, high-frequency trading in financial markets, and real-time analysis in scientific research facilities.

Other people’s search terms

– High-performance computing solutions

– AI and machine learning accelerators

– Automotive ADAS and autonomous driving technology

– Industrial automation and control systems

– Energy-efficient processing chips

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
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Global Logistics
Global logistics are available for delivery
B2B Sales
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24/7 Support
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