Specification of XC7S75-2FGGA676C | |
---|---|
Status | Active |
Series | Spartan?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6000 |
Number of Logic Elements/Cells | 76800 |
Total RAM Bits | 4331520 |
Number of I/O | 400 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FPBGA (27×27) |
Applications
The XC7S75-2FGGA676C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device supports operations at temperatures ranging from -40°C to +85°C, ensuring reliability across various climates.
Key Advantages
1. High clock speed up to 200 MHz, enhancing computational performance significantly.
2. Advanced memory interface supporting DDR4 RAM, improving data throughput.
3. Low power consumption per gigaflop, making it energy-efficient.
4. Compliance with industry-standard certifications like ISO 9001 and CE Marking.
Frequently Asked Questions
Q1: Can the XC7S75-2FGGA676C operate effectively in extreme temperatures?
A1: Yes, it operates within a wide temperature range (-40°C to +85°C), making it suitable for both indoor and outdoor applications.
Q2: What kind of memory does the XC7S75-2FGGA676C support?
A2: The XC7S75-2FGGA676C supports DDR4 memory, which enhances its data handling capacity and speed.
Q3: In which specific scenarios would you recommend using the XC7S75-2FGGA676C?
A3: The XC7S75-2FGGA676C is recommended for scenarios requiring high-speed data processing and low-power consumption, such as AI model training and real-time analytics.
Other people’s search terms
– High-performance computing solutions
– DDR4 memory support devices
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– Extreme temperature operation electronics