XC7S75-1FGGA676I

Applications

The XC7S75-1FGGA676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device supports operations at temperatures ranging from -40°C to +85°C, ensuring reliability across various climates.

Key Advantages

1. High clock speed up to 100 MHz, enabling faster processing tasks.

2. Advanced memory interface supporting DDR4 RAM for enhanced data throughput.

3. Energy-efficient design with low power consumption per gigaflop.

4. Compliance with industry-standard certifications like ISO 9001 and CE Marking.

Frequently Asked Questions

Q1: Can the XC7S75-1FGGA676I operate effectively in extreme temperatures?

A1: Yes, it operates within a wide temperature range (-40°C to +85°C), making it suitable for both indoor and outdoor applications.

Q2: Is there any specific hardware requirement when interfacing with the XC7S75-1FGGA676I?

A2: The XC7S75-1FGGA676I requires compatible DDR4 memory modules and appropriate cooling solutions to ensure optimal performance and longevity.

Q3: In which industries can the XC7S75-1FGGA676I be utilized?

A3: This chip is commonly used in sectors requiring high computational power, such as telecommunications, automotive electronics, and scientific research.

Other people’s search terms

– High-speed FPGA solution

– DDR4 memory support FPGA

– Low-power FPGA design

– Industrial-grade FPGA

– AI-acceleration FPGA module