Specification of XC7S25-1CSGA324I | |
---|---|
Status | Active |
Series | Spartan?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 1825 |
Number of Logic Elements/Cells | 23360 |
Total RAM Bits | 1658880 |
Number of I/O | 150 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 324-LFBGA, CSPBGA |
Supplier Device Package | 324-CSGA (15×15) |
Applications
The XC7S25-1CSGA324I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device supports operations at temperatures ranging from -40°C to +85°C, ensuring reliability across various climates.
Key Advantages
1. High clock speed up to 600 MHz, enhancing computational performance significantly.
2. Advanced memory interface supporting DDR4 RAM for faster data transfer rates.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Compliance with industry-standard certifications like ISO 9001 and CE marking for global market acceptance.
Frequently Asked Questions
Q1: Can the XC7S25-1CSGA324I operate effectively in extreme temperatures?
A1: Yes, it operates within a wide temperature range (-40°C to +85°C), making it suitable for both indoor and outdoor applications.
Q2: Is there any specific hardware requirement when interfacing with the XC7S25-1CSGA324I?
A2: The XC7S25-1CSGA324I requires compatible DDR4 memory modules and appropriate cooling solutions to ensure optimal performance and longevity.
Q3: In which industries can the XC7S25-1CSGA324I be utilized most effectively?
A3: It is particularly effective in sectors requiring high-speed data processing and analysis, such as finance, healthcare, and automotive.
Other people’s search terms
– High-performance computing solutions
– DDR4 memory support devices
– Temperature-resistant processors
– AI training model accelerators
– Cloud computing hardware components