Specification of XC7K70T-2FBG676I | |
---|---|
Status | Active |
Series | Kintex?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 5125 |
Number of Logic Elements/Cells | 65600 |
Total RAM Bits | 4976640 |
Number of I/O | 300 |
Number of Gates | – |
Voltage – Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7K70T-2FBG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This FPGA supports operations at temperatures ranging from -40°C to +85°C, ensuring reliability across various climates.
Key Advantages
1. High-speed data processing rate up to 10 Gbps.
2. Advanced parallel processing architecture enabling faster computations.
3. Low power consumption of only 15W under typical usage conditions.
4. Meets industry-standard certifications including CE, FCC, and RoHS.
Frequently Asked Questions
Q1: Can the XC7K70T-2FBG676I be used in high-temperature environments?
A1: Yes, it operates effectively within a temperature range of -40°C to +85°C, making it suitable for diverse environmental conditions.
Q2: What are the compatibility requirements for the XC7K70T-2FBG676I?
A2: The XC7K70T-2FBG676I is compatible with a wide range of software platforms and hardware interfaces, supporting both legacy and modern systems without requiring significant modifications.
Q3: In which specific scenarios would you recommend using the XC7K70T-2FBG676I?
A3: The XC7K70T-2FBG676I is recommended for scenarios involving complex signal processing, such as in telecommunications networks, automotive electronics, and industrial automation systems where high performance and low latency are critical.
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