XC7K325T-2FF676I

Applications

The XC7K325T-2FF676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 300 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: Can the XC7K325T-2FF676I operate effectively in extreme temperatures?

A1: Yes, the device operates within a wide temperature range (-40°C to +85°C), making it suitable for both cold and hot environments.

Q2: What are the specific memory interfaces supported by the XC7K325T-2FF676I?

A2: The XC7K325T-2FF676I supports DDR4 memory interfaces with speeds up to 2666 MT/s, offering high-speed data transfer capabilities.

Q3: In which industries is the XC7K325T-2FF676I commonly used?

A3: Commonly used in data centers, cloud computing services, and large-scale scientific simulations where high performance and reliability are critical.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support devices

– Industrial-grade temperature operation

– Energy-efficient FPGA solutions

– Certified for global markets