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XC7A25T-2CSG325C

Part Number XC7A25T-2CSG325C
Manufacturer Xilinx
Description IC FPGA 150 I/O 324CSBGA
Price for XC7A25T-2CSG325C
Specification of XC7A25T-2CSG325C
Status Active
Series Artix-7
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 1825
Number of Logic Elements/Cells 23360
Total RAM Bits 1658880
Number of I/O 150
Number of Gates
Voltage – Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 324-LFBGA, CSPBGA
Supplier Device Package 324-CSPBGA (15×15)

Applications

The XC7A25T-2CSG325C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 667 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR3L at speeds up to 1600 MHz, enhancing data throughput.

3. Low power consumption per gigaflop, making it energy-efficient for extended operation.

4. Compliance with industry-standard certifications like CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: Can the XC7A25T-2CSG325C be used in high-temperature environments?

A1: Yes, the device supports operation in temperatures ranging from -40°C to +85°C, making it suitable for high-temperature applications.

Q2: What is the maximum memory bandwidth supported by the XC7A25T-2CSG325C?

A2: The XC7A25T-2CSG325C can support DDR3L memory at speeds up to 1600 MHz, providing a maximum memory bandwidth of approximately 12.8 GB/s.

Q3: In which specific scenarios would you recommend using the XC7A25T-2CSG325C?

A3: The XC7A25T-2CSG325C is recommended for scenarios requiring high-speed data processing and low-power consumption, such as AI model training, real-time data analysis, and embedded systems that need to operate efficiently under varying thermal conditions.

Other people’s search terms

– High-performance computing solutions

– Artificial intelligence hardware accelerators

– Cloud computing infrastructure components

– Energy-efficient processing units

– Industrial-grade FPGA devices

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
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Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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