Specification of XC7A200T-2FFG1156C | |
---|---|
Status | Active |
Series | Artix-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 16825 |
Number of Logic Elements/Cells | 215360 |
Total RAM Bits | 13455360 |
Number of I/O | 500 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XC7A200T-2FFG1156C is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring extensive parallel processing capabilities, such as machine learning algorithms, big data analytics, and scientific simulations. This FPGA can operate within a wide range of temperatures from -40°C to +85°C, making it suitable for industrial settings that require robust performance under varying conditions.
Key Advantages
1. High computational throughput at up to 200 MHz, supporting complex algorithm execution efficiently.
2. Advanced interconnectivity features allowing for efficient communication between multiple processing elements.
3. Low power consumption per gigabit, reducing operational costs significantly.
4. Compliance with various industry certifications ensuring reliability and safety in critical applications.
Frequently Asked Questions
Q1: Can the XC7A200T-2FFG1156C be used in high-temperature environments?
A1: Yes, it operates effectively within a temperature range of -40°C to +85°C, making it suitable for both indoor and outdoor applications.
Q2: What is the maximum speed at which the XC7A200T-2FFG1156C can run?
A2: The XC7A200T-2FFG1156C can achieve speeds up to 200 MHz, providing high-speed processing capabilities.
Q3: In which specific scenarios would you recommend using the XC7A200T-2FFG1156C?
A3: The XC7A200T-2FFG1156C is recommended for scenarios involving large-scale data processing, such as real-time analysis in financial markets, predictive modeling in healthcare, and high-resolution imaging in aerospace applications.
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