Specification of XC7A200T-2FBG676I | |
---|---|
Status | Active |
Series | Artix-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 16825 |
Number of Logic Elements/Cells | 215360 |
Total RAM Bits | 13455360 |
Number of I/O | 400 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Applications
The XC7A200T-2FBG676I is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring extensive parallel processing capabilities, such as machine learning algorithms, big data analytics, and scientific simulations. This device supports a wide range of operating temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High-speed data processing at up to 200 MHz.
2. Advanced memory interface supporting DDR4 RAM.
3. Energy-efficient design with low power consumption.
4. Compliance with multiple industry certifications including ISO 9001 and CE Marking.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XC7A200T-2FBG676I?
A1: The XC7A200T-2FBG676I operates within a temperature range of -40°C to +85°C.
Q2: Can the XC7A200T-2FBG676I be used in conjunction with other FPGA devices?
A2: Yes, the XC7A200T-2FBG676I can be integrated with other FPGA devices through its versatile I/O interfaces and support for multiple communication protocols.
Q3: In which specific scenarios would the XC7A200T-2FBG676I be most beneficial?
A3: The XC7A200T-2FBG676I is particularly beneficial in scenarios requiring high computational throughput, such as real-time signal processing, encryption tasks, and complex algorithmic computations.
Other people’s search terms
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