Specification of XC6VLX365T-1FFG1759C | |
---|---|
Status | Active |
Series | Virtex?-6 LXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 28440 |
Number of Logic Elements/Cells | 364032 |
Total RAM Bits | 15335424 |
Number of I/O | 720 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 1759-BBGA, FCBGA |
Supplier Device Package | 1759-FCBGA (42.5×42.5) |
Applications
The XC6VLX365T-1FFG1759C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and scientific simulations. This device operates within a wide temperature range from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 365 MHz, providing superior computational performance.
2. Advanced parallel processing architecture that enhances data throughput.
3. Energy-efficient design with low power consumption per gigaflop.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can the XC6VLX365T-1FFG1759C be used in extreme temperatures?
A1: Yes, it can operate effectively between -40°C and +85°C, ensuring reliability in harsh environments.
Q2: What are the compatibility requirements for this device?
A2: The XC6VLX365T-1FFG1759C is compatible with standard 2.5 Gbps DDR4 memory modules and supports PCIe Gen3 x16 lanes for enhanced connectivity options.
Q3: In which specific scenarios would you recommend using this XC6VLX365T-1FFG1759C?
A3: This device is recommended for scenarios requiring high-speed data processing, such as real-time machine learning models, large-scale database queries, and complex simulation tasks.
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