XC6VHX380T-1FFG1923C

Applications

The XC6VHX380T-1FFG1923C is ideal for high-performance computing environments due to its robust design and high-speed capabilities. It excels in applications such as data centers, cloud computing services, and advanced scientific research projects. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.

Key Advantages

1. Operating speed up to 760 MHz, providing exceptional processing power.

2. Advanced memory interface technology that enhances data transfer rates significantly.

3. Energy-efficient design with low power consumption, reducing operational costs.

4. Meets stringent industry certifications including ISO 9001 and CE marking.

Frequently Asked Questions

Q1: Can this XC6VHX380T-1FFG1923C be used in extreme temperature environments?

A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for both indoor and outdoor applications.

Q2: What are the specific features that make this chip unique compared to other similar products?

A2: The XC6VHX380T-1FFG1923C offers superior performance metrics and energy efficiency, along with advanced memory interfaces that outperform competitors in most benchmarks.

Q3: In which industries has this XC6VHX380T-1FFG1923C been successfully implemented?

A3: This chip has been deployed in major data centers worldwide, enhancing their computational capacity and reliability. It also supports applications in aerospace and defense sectors requiring high-performance computing solutions.

Other people’s search terms

– High-speed computing solution

– Robust memory interface technology

– Energy-efficient processor

– Industrial-grade temperature operation

– Advanced scientific research support