Specification of XC6VCX75T-1FFG784C | |
---|---|
Status | Active |
Series | Virtex?-6 CXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 5820 |
Number of Logic Elements/Cells | 74496 |
Total RAM Bits | 5750784 |
Number of I/O | 360 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 784-BBGA, FCBGA |
Supplier Device Package | 784-FCBGA (29×29) |
Applications
The XC6VCX75T-1FFG784C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 1GHz, enabling faster processing times.
2. Advanced parallel processing architecture that enhances computational throughput.
3. Low power consumption, reducing operational costs and heat generation.
4. Compliant with multiple industry-standard certifications, ensuring robust security and compliance.
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XC6VCX75T-1FFG784C?
A1: The maximum operating temperature of the XC6VCX75T-1FFG784C is +85¡ãC.
Q2: Can the XC6VCX75T-1FFG784C be used in conjunction with other components?
A2: Yes, it can be integrated with various other components through standard interfaces like PCIe and DDR4, enhancing its versatility in different system architectures.
Q3: In which specific scenarios would you recommend using the XC6VCX75T-1FFG784C?
A3: The XC6VCX75T-1FFG784C is recommended for scenarios requiring high-speed data processing, such as real-time analysis in financial markets, deep learning model training, and high-frequency trading systems.
Other people’s search terms
– High-performance computing solutions
– AI acceleration with XC6VCX75T-1FFG784C
– Cloud computing hardware options
– Efficient processing for big data analytics
– Temperature-resistant computing devices