Specification of XC6SLX9-N3FT256C | |
---|---|
Status | Obsolete |
Series | Spartan?-6 LX |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 715 |
Number of Logic Elements/Cells | 9152 |
Total RAM Bits | 589824 |
Number of I/O | 186 |
Number of Gates | – |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FTBGA (17×17) |
Applications
The XC6SLX9-N3FT256C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in fields such as artificial intelligence training, big data analytics, and scientific simulations. This device operates within a wide temperature range from -40¡ãC to +85¡ãC, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 750 MHz, enhancing computational performance significantly.
2. Advanced parallel processing architecture that supports multiple concurrent operations efficiently.
3. Low power consumption per gigaflop, reducing operational costs and energy usage.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can the XC6SLX9-N3FT256C be used in extreme temperatures?
A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, ensuring reliability in harsh environments.
Q2: What are the compatibility requirements for software running on this device?
A2: The XC6SLX9-N3FT256C supports a wide range of operating systems and software architectures, including Linux, Windows, and various AI frameworks like TensorFlow and PyTorch.
Q3: In which specific scenarios would you recommend using this XC6SLX9-N3FT256C?
A3: This device is recommended for scenarios requiring high-speed data processing, such as real-time data analysis in financial markets, predictive maintenance in manufacturing plants, and complex simulation tasks in aerospace engineering.
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