XC6SLX9-3CSG225I

Applications

The XC6SLX9-3CSG225I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XC6SLX9-3CSG225I?

A1: The XC6SLX9-3CSG225I operates within a temperature range of -40°C to +85°C, ensuring reliability across diverse environments.

Q2: Can the XC6SLX9-3CSG225I be used in conjunction with other components for enhanced functionality?

A2: Yes, the XC6SLX9-3CSG225I can integrate seamlessly with various other components through its robust I/O interfaces, enabling complex system architectures.

Q3: In which specific scenarios would the XC6SLX9-3CSG225I be most beneficial?

A3: The XC6SLX9-3CSG225I is particularly beneficial in scenarios requiring high-speed data processing and analysis, such as real-time analytics in financial markets and predictive modeling in healthcare.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support

– Industrial-grade temperature range

– Energy-efficient FPGA

– Compliance certifications for XC6SLX9-3CSG225I