XC6SLX75T-N3FGG676I

Applications

The XC6SLX75T-N3FGG676I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 500 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Meets stringent industrial certification standards including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: Can the XC6SLX75T-N3FGG676I be used in high-temperature environments?

A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for both indoor and outdoor applications.

Q2: What are the specific memory interfaces supported by the XC6SLX75T-N3FGG676I?

A2: The device supports DDR4 memory with speeds up to 2666 MT/s, which is beneficial for high-speed data processing tasks.

Q3: In which industries is the XC6SLX75T-N3FGG676I commonly used?

A3: Commonly used in sectors like telecommunications, automotive electronics, and aerospace, where high-performance and reliability are paramount.

Other people’s search terms

– High-performance computing solutions

– Artificial intelligence hardware components

– Cloud computing infrastructure enhancements

– Industrial-grade memory interface technology

– Energy-efficient processor architectures