XC6SLX25T-3FGG484C

Applications

The XC6SLX25T-3FGG484C is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: Can the XC6SLX25T-3FGG484C be used in high-temperature environments?

A1: Yes, it can operate effectively between -40°C and +85°C, ensuring reliability in diverse environmental conditions.

Q2: What are the specific memory interfaces supported by the XC6SLX25T-3FGG484C?

A2: The device supports DDR4 memory with speeds up to 2666 MT/s, optimizing memory bandwidth and access times.

Q3: In which industries is the XC6SLX25T-3FGG484C particularly suited?

A3: It is well-suited for industries requiring high-performance computing solutions, such as telecommunications, automotive, and financial services.

Other people’s search terms

– High-speed processing solution
– DDR4 memory support
– Industrial-grade temperature range
– Energy-efficient FPGA
– AI and machine learning applications