Specification of XC6SLX16-3CPG196C | |
---|---|
Status | Active |
Series | Spartan?-6 LX |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 1139 |
Number of Logic Elements/Cells | 14579 |
Total RAM Bits | 589824 |
Number of I/O | 106 |
Number of Gates | – |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 196-TFBGA, CSBGA |
Supplier Device Package | 196-CSPBGA (8×8) |
Applications
The XC6SLX16-3CPG196C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 750 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.
Frequently Asked Questions
Q1: Can the XC6SLX16-3CPG196C operate effectively in extreme temperatures?
A1: Yes, it operates within a wide temperature range (-40°C to +85°C), making it suitable for both indoor and outdoor applications.
Q2: What are the specific memory configurations supported by the XC6SLX16-3CPG196C?
A2: The device supports dual-channel DDR4 memory with capacities up to 128 GB, offering flexible configuration options for different application needs.
Q3: In which industries is the XC6SLX16-3CPG196C commonly used?
A3: Commonly used in telecommunications, automotive electronics, and aerospace sectors, particularly in systems requiring high reliability and performance.
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