XC6SLX16-2FTG256I

Applications

The XC6SLX16-2FTG256I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports a wide range of operating temperatures from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR3 SDRAM for enhanced data throughput.

3. Energy-efficient design with low power consumption per gigaflop, reducing operational costs.

4. Compliance with multiple certification standards including CE, FCC, and RoHS.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XC6SLX16-2FTG256I?

A1: The XC6SLX16-2FTG256I operates within a temperature range of -40°C to +85°C, ensuring reliability across diverse environments.

Q2: Can the XC6SLX16-2FTG256I be used in conjunction with other components for system integration?

A2: Yes, the XC6SLX16-2FTG256I is designed to integrate seamlessly with various other components, facilitating complex system architectures.

Q3: In which specific scenarios would the XC6SLX16-2FTG256I be most beneficial?

A3: The XC6SLX16-2FTG256I is particularly beneficial in scenarios requiring high-speed data processing and analysis, such as real-time data streaming in financial markets and high-resolution imaging in medical diagnostics.

Other people’s search terms

– High-performance computing solutions

– Industrial-grade FPGA devices

– Low-power FPGAs for embedded systems

– DDR3 SDRAM support in FPGAs

– Temperature-resistant FPGA modules