XC6SLX16-2CPG196C

Applications

The XC6SLX16-2CPG196C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR3 SDRAM, enhancing data throughput.

3. Low power consumption, reducing operational costs and energy usage.

4. Compliance with multiple industry certifications, including CE and FCC.

Frequently Asked Questions

Q1: What is the maximum operating temperature for the XC6SLX16-2CPG196C?

A1: The maximum operating temperature for the XC6SLX16-2CPG196C is +85°C.

Q2: Can the XC6SLX16-2CPG196C be used in conjunction with other components?

A2: Yes, it can be integrated with various other components through its advanced I/O interfaces, making it versatile for different system architectures.

Q3: In which specific scenarios would you recommend using the XC6SLX16-2CPG196C?

A3: The XC6SLX16-2CPG196C is recommended for scenarios requiring high-speed data processing and low-latency operations, such as real-time analytics and high-frequency trading systems.

Other people’s search terms

– High-performance computing solutions

– DDR3 SDRAM support

– Low-power FPGA devices

– Industry-standard certifications

– Scalable data center components