XC6SLX150T-2FGG484C

Applications

The XC6SLX150T-2FGG484C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: Can the XC6SLX150T-2FGG484C operate effectively in extreme temperatures?

A1: Yes, it operates within a wide range of temperatures (-40°C to +85°C), ensuring reliability across diverse environments.

Q2: What are the specific memory configurations supported by this device?

A2: The XC6SLX150T-2FGG484C supports dual-channel DDR4 memory with capacities up to 128 GB, offering flexible configuration options.

Q3: In which industries is the XC6SLX150T-2FGG484C commonly utilized?

A3: Commonly used in telecommunications, automotive electronics, and aerospace sectors, particularly in systems requiring high-speed processing and reliable performance under varying conditions.

Other people’s search terms

– High-performance computing solutions

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– Industry-standard certified FPGAs