XC6SLX150-3FGG900I

Applications

The XC6SLX150-3FGG900I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports a wide range of operating temperatures from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: Can the XC6SLX150-3FGG900I operate effectively in extreme temperatures?

A1: Yes, it operates within a broad temperature range (-40°C to +85°C), ensuring reliability across diverse environments.

Q2: What are the specific memory configurations supported by the XC6SLX150-3FGG900I?

A2: The device supports dual-channel DDR4 memory with capacities ranging from 8GB to 64GB per channel, offering flexibility in memory configuration options.

Q3: In which industries is the XC6SLX150-3FGG900I particularly suited?

A3: It is well-suited for industries requiring high-performance computing solutions, such as finance, healthcare, and automotive sectors, where rapid data processing and analysis are critical.

Other people’s search terms

– High-speed processing solution

– Industrial-grade computing module

– DDR4 memory support

– Temperature-resistant processor

– Energy-efficient FPGA