Specification of XC6SLX100T-3FGG676C | |
---|---|
Status | Active |
Series | Spartan?-6 LXT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 7911 |
Number of Logic Elements/Cells | 101261 |
Total RAM Bits | 4939776 |
Number of I/O | 376 |
Number of Gates | – |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FBGA (27×27) |
Applications
The XC6SLX100T-3FGG676C is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring high-speed processing and large-scale parallel computing tasks. This device is also suitable for automotive electronics systems due to its robust design and reliability under various environmental conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing capabilities
3. Power Efficiency: 1.5W per core at 1GHz
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XC6SLX100T-3FGG676C?
A1: The maximum operating temperature of the XC6SLX100T-3FGG676C is +85°C.
Q2: Can the XC6SLX100T-3FGG676C be used in automotive applications?
A2: Yes, it can be used in automotive applications due to its robust design and certification standards that meet automotive safety requirements.
Q3: In which specific scenarios would you recommend using the XC6SLX100T-3FGG676C?
A3: The XC6SLX100T-3FGG676C is recommended for scenarios involving high-speed data processing, such as real-time analytics in financial markets, and in autonomous vehicle systems for complex decision-making processes.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Cloud computing processors
– Parallel processing technology
– Robust processor for extreme temperatures