XC6SLX100-3FG676I

Applications

The XC6SLX100-3FG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports a wide range of operating temperatures from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 500 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.

Frequently Asked Questions

Q1: Can the XC6SLX100-3FG676I operate effectively in extreme temperatures?

A1: Yes, it operates within a broad temperature range (-40°C to +85°C), ensuring reliability across diverse environments.

Q2: What are the specific memory configurations supported by the XC6SLX100-3FG676I?

A2: The device supports dual-channel DDR4 memory with capacities ranging from 8GB to 64GB per channel, offering flexibility in memory configuration options.

Q3: In which industries is the XC6SLX100-3FG676I commonly utilized?

A3: Commonly used in telecommunications, automotive electronics, and aerospace sectors, particularly in systems requiring high-speed processing and reliable performance under varying conditions.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support in FPGA devices

– Temperature-resistant FPGA processors

– Energy-efficient FPGA architectures

– Industry-standard certified FPGAs