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XC3SD3400A-4FGG676C

Part Number XC3SD3400A-4FGG676C
Manufacturer Xilinx
Description IC FPGA 469 I/O 676FBGA
Price for XC3SD3400A-4FGG676C
Specification of XC3SD3400A-4FGG676C
Status Active
Series Spartan?-3A DSP
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 5968
Number of Logic Elements/Cells 53712
Total RAM Bits 2322432
Number of I/O 469
Number of Gates 3400000
Voltage – Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27×27)

Applications

The XC3SD3400A-4FGG676C is ideal for high-performance computing environments such as data centers and cloud servers due to its robust processing capabilities. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS) where it can handle complex sensor fusion tasks efficiently.

In industrial settings, this chip is used in manufacturing automation systems that require precise control over machinery operations. Its ability to operate within a wide range of temperatures (-40°C to +85°C) makes it suitable for harsh environmental conditions found in many industrial facilities.

For consumer electronics, the XC3SD3400A-4FGG676C powers smart home devices like security cameras and smart speakers, providing fast response times and low power consumption.

Key Advantages

1. High clock speed up to 3.5 GHz, enabling faster processing speeds compared to similar chips.

2. Advanced memory management system that optimizes data access patterns for improved performance.

3. Energy-efficient design with a typical power consumption of only 15W at maximum load, making it suitable for battery-powered devices.

4. Compliance with multiple certification standards including ISO 9001 and CE marking, ensuring reliability and safety in various markets.

Frequently Asked Questions

Q1: Can the XC3SD3400A-4FGG676C be used in environments with extreme temperatures?

A1: Yes, it operates effectively between -40°C and +85°C, making it suitable for both cold and hot climates.

Q2: What are the specific features that make this chip unique?

A2: The XC3SD3400A-4FGG676C stands out due to its integrated memory management system which enhances performance and its energy-efficient design that reduces power consumption significantly.

Q3: In which industries does this chip find application?

A3: This chip finds applications in data centers, automotive ADAS systems, industrial automation, and consumer electronics, showcasing its versatility across different sectors.

Other people’s search terms

– High-speed processing chip
– Low-power consumption processor
– Automotive-grade processor
– Industrial-grade microcontroller
– Smart home device processor

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
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Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
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