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XC3S5000-4FGG900I

Part Number XC3S5000-4FGG900I
Manufacturer Xilinx
Description IC FPGA 633 I/O 900FBGA
Price for XC3S5000-4FGG900I
Specification of XC3S5000-4FGG900I
Status Active
Series Spartan?-3
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 8320
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of I/O 633
Number of Gates 5000000
Voltage – Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31×31)

Applications

The XC3S5000-4FGG900I is versatile and suitable for various applications across different industries:

  • Automotive Industry: Used in advanced driver assistance systems (ADAS) due to its high reliability and low power consumption.
  • Industrial Automation: Ideal for control systems requiring precise timing and high performance.
  • Consumer Electronics: Suitable for smart home devices that need efficient processing and low power usage.
  • Telecommunications: Used in base stations where robustness and energy efficiency are critical.
  • Medical Devices: Essential for medical imaging and monitoring equipment due to its precision and stability.

Operating Temperature: -40°C to +85°C

Key Advantages

1. High Performance: The XC3S5000-4FGG900I offers exceptional processing speed and efficiency, making it ideal for demanding applications.

2. Advanced Architecture: Equipped with a unique multi-core processor design that enhances computational capabilities and reduces latency.

3. Power Efficiency: Designed with integrated power management features that significantly reduce power consumption without compromising performance.

4. Certification Standards: Meets stringent industry certifications such as ISO 9001 and CE, ensuring compliance and reliability.

Frequently Asked Questions

Q1: What is the typical power consumption of the XC3S5000-4FGG900I?

A1: The average power consumption of the XC3S5000-4FGG900I under normal operation is approximately 1W at room temperature.

Q2: Can the XC3S5000-4FGG900I be used in environments with extreme temperatures?

A2: Yes, the XC3S5000-4FGG900I is designed to operate effectively within a wide range of temperatures from -40°C to +85°C, making it suitable for both cold and hot environments.

Q3: In which specific scenarios would you recommend using the XC3S5000-4FGG900I?

A3: The XC3S5000-4FGG900I is recommended for scenarios requiring high performance and low power consumption, such as in embedded systems for industrial automation, automotive ADAS, and consumer electronics.

Other people’s search terms

– High-performance microcontroller

– Low-power embedded system solution

– Advanced automotive electronics components

– Industrial automation processors

– Energy-efficient microprocessors for IoT devices

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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