Specification of XC3S4000-5FGG676C | |
---|---|
Status | Active |
Series | Spartan?-3 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6912 |
Number of Logic Elements/Cells | 62208 |
Total RAM Bits | 1769472 |
Number of I/O | 489 |
Number of Gates | 4000000 |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FBGA (27×27) |
Applications
The XC3S4000-5FGG676C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in server applications where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive systems requiring precise control and safety features, such as advanced driver assistance systems (ADAS). In industrial settings, it supports automation processes that demand reliability and scalability.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing engine
3. Power Efficiency: 1.5W at 1GHz clock speed
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC3S4000-5FGG676C be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: Is there any specific software requirement for this chip?
A2: The XC3S4000-5FGG676C requires a compatible operating system and drivers optimized for its architecture. It supports standard Linux distributions and Windows environments.
Q3: How does this chip perform in high-speed networking applications?
A3: The XC3S4000-5FGG676C is designed to handle high-speed data transmission, ensuring reliable performance in networking applications without degradation.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Industrial automation processors
– Robust embedded systems
– Advanced processor technology