Specification of XC3S4000-4FGG900C | |
---|---|
Status | Active |
Series | Spartan?-3 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6912 |
Number of Logic Elements/Cells | 62208 |
Total RAM Bits | 1769472 |
Number of I/O | 633 |
Number of Gates | 4000000 |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 900-BBGA |
Supplier Device Package | 900-FBGA (31×31) |
Applications
The XC3S4000-4FGG900C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in server applications where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive systems requiring precise control and safety features, such as advanced driver assistance systems (ADAS). In industrial settings, it supports automation and robotics, offering reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W at 1GHz clock speed
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC3S4000-4FGG900C be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: Is there any specific software requirement for this chip?
A2: The XC3S4000-4FGG900C requires a compatible operating system that supports its advanced features. It is recommended to use the latest version of the operating system for optimal performance.
Q3: How does this chip perform in high-speed networking applications?
A3: The XC3S4000-4FGG900C is designed to support high-speed networking protocols, ensuring fast and reliable data transmission even under heavy loads.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Industrial automation processors
– Robotic control systems
– Extreme temperature operation chips