Specification of XC3S200AN-4FTG256I | |
---|---|
Status | Active |
Series | Spartan?-3AN |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 448 |
Number of Logic Elements/Cells | 4032 |
Total RAM Bits | 294912 |
Number of I/O | 195 |
Number of Gates | 200000 |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FTBGA (17×17) |
Applications
The XC3S200AN-4FTG256I is ideal for embedded systems requiring high performance and low power consumption. It excels in automotive applications such as engine control units due to its robustness at temperatures ranging from -40°C to +85°C. In industrial settings, it supports harsh environments with its wide operating temperature range, making it suitable for machinery control systems.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Advanced Logic Cell Array
3. Low Power Consumption: 1.5W at 100MHz
4. Industry Standard Certifications: CE, RoHS
Frequently Asked Questions
Q1: Can the XC3S200AN-4FTG256I operate effectively in extreme cold conditions?
A1: Yes, it operates within a temperature range of -40°C to +85°C, ensuring reliable performance even in extremely cold environments.
Q2: Is the XC3S200AN-4FTG256I compatible with various communication protocols?
A2: The XC3S200AN-4FTG256I supports multiple communication interfaces including SPI, I2C, and UART, providing flexibility in integration with different systems.
Q3: How does the XC3S200AN-4FTG256I handle complex logic operations efficiently?
A3: With its advanced logic cell array, the XC3S200AN-4FTG256I can execute complex logic operations quickly while maintaining low power consumption.
Other people’s search terms
– Embedded System Solutions
– Automotive Electronics Components
– Industrial Control Systems
– High Performance Microcontrollers
– Low Power Consumption Devices