Specification of XC3S200AN-4FTG256C | |
---|---|
Status | Active |
Series | Spartan?-3AN |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 448 |
Number of Logic Elements/Cells | 4032 |
Total RAM Bits | 294912 |
Number of I/O | 195 |
Number of Gates | 200000 |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FTBGA (17×17) |
Applications
The XC3S200AN-4FTG256C is ideal for embedded systems requiring high performance and low power consumption. It is commonly used in automotive electronics, industrial control systems, and consumer electronics due to its robustness and reliability.
Operating Temperature: -40°C to +85°C
Key Advantages
1. High Performance: The XC3S200AN-4FTG256C offers up to 200 MHz processing speed, making it suitable for complex computational tasks.
2. Unique Architecture Feature: It includes a dedicated hardware accelerator for cryptographic operations, enhancing security capabilities.
3. Power Efficiency: With a typical power consumption of 150 mW at 100 MHz, it is highly energy-efficient.
4. Certification Standards: It meets various industry certifications such as ISO 9001 and CE marking, ensuring compliance with international standards.
Frequently Asked Questions
Q1: Can the XC3S200AN-4FTG256C be used in high-temperature environments?
A1: Yes, it operates within a wide temperature range from -40°C to +85°C, making it suitable for harsh environments.
Q2: Is there any specific software required for programming this device?
A2: No special software is required; standard FPGA development tools like Xilinx Vivado can be used for programming.
Q3: In which specific scenarios would you recommend using this XC3S200AN-4FTG256C?
A3: This device is recommended for applications that require both high performance and security, such as secure payment terminals and advanced automotive safety systems.
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