Specification of XC3S2000-5FGG676C | |
---|---|
Status | Active |
Series | Spartan?-3 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 5120 |
Number of Logic Elements/Cells | 46080 |
Total RAM Bits | 737280 |
Number of I/O | 489 |
Number of Gates | 2000000 |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FBGA (27×27) |
Applications
The XC3S2000-5FGG676C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in server applications where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive systems requiring precise control and monitoring, such as engine management and safety features. In industrial settings, it supports automation systems that demand reliable operation under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W at 1GHz clock speed
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC3S2000-5FGG676C be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: Is there any specific software required for optimal performance?
A2: The XC3S2000-5FGG676C is compatible with standard operating systems like Linux and Windows, but specialized drivers may be needed for certain hardware peripherals.
Q3: How does this chip perform in high-speed networking applications?
A3: The XC3S2000-5FGG676C supports high-speed data transfer rates up to 10 Gbps, making it suitable for high-speed networking applications.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Industrial automation processors
– Robust embedded systems
– Low-power microprocessors