Specification of XC3S1200E-4FGG320C | |
---|---|
Status | Active |
Series | Spartan?-3E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 2168 |
Number of Logic Elements/Cells | 19512 |
Total RAM Bits | 516096 |
Number of I/O | 250 |
Number of Gates | 1200000 |
Voltage – Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 320-BGA |
Supplier Device Package | 320-FBGA (19×19) |
Applications
The XC3S1200E-4FGG320C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in server applications where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive systems requiring precise control and monitoring, such as engine management and safety features.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing architecture
3. Power Efficiency: 1.5W at 100MHz
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC3S1200E-4FGG320C be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for various industrial applications that require robust performance under harsh conditions.
Q2: Is there any specific software required for programming this device?
A2: The XC3S1200E-4FGG320C supports standard development tools like Xilinx ISE Webpack, which includes comprehensive libraries and examples for easy integration into projects.
Q3: In what specific scenarios would you recommend using this XC3S1200E-4FGG320C?
A3: This chip is recommended for scenarios involving real-time data processing, such as in financial trading platforms where speed and reliability are critical, and in medical devices where precision and low power consumption are essential.
Other people’s search terms
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