Specification of XC2V3000-4FG676C | |
---|---|
Status | Active |
Series | Virtex?-II |
Package | Bulk |
Supplier | Rochester Electronics, LLC |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 3584 |
Number of Logic Elements/Cells | – |
Total RAM Bits | 1769472 |
Number of I/O | 484 |
Number of Gates | 3000000 |
Voltage – Supply | 1.425V ~ 1.575V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FBGA (27×27) |
Applications
The XC2V3000-4FG676C is ideal for high-performance computing environments due to its robust design and high-speed capabilities. It excels in server applications where it can handle complex data processing tasks efficiently. Additionally, it is suitable for automotive systems requiring reliable performance under varying conditions.
Operating Temperature: -40°C to +85°C
Key Advantages
1. High clock speed up to 300 MHz
2. Advanced power management features reducing energy consumption
3. Low power consumption of only 1.5W at maximum load
4. Compliant with multiple industry certifications including ISO 9001 and CE Marking
Frequently Asked Questions
Q1: Can the XC2V3000-4FG676C be used in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various industrial applications.
Q2: What are the compatibility requirements for this chip?
A2: The XC2V3000-4FG676C is compatible with standard 4-layer PCBs and requires specific soldering techniques to ensure optimal performance.
Q3: In which specific scenarios would you recommend using this XC2V3000-4FG676C?
A3: This chip is recommended for scenarios involving real-time data processing, such as in financial trading systems and medical imaging devices.
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