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XC2S600E-6FGG456C

Part Number XC2S600E-6FGG456C
Manufacturer Xilinx
Description IC FPGA 329 I/O 456FBGA
Datasheets Download XC2S600E-6FGG456C Datasheet PDFPDF Icon
Price for XC2S600E-6FGG456C
Specification of XC2S600E-6FGG456C
Status Obsolete
Series Spartan?-IIE
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 3456
Number of Logic Elements/Cells 15552
Total RAM Bits 294912
Number of I/O 329
Number of Gates 600000
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23×23)

Applications

The XC2S600E-6FGG456C is ideal for high-speed digital signal processing tasks in telecommunications equipment, where it can handle complex algorithms efficiently within its specified operating temperature range of -40¡ãC to +85¡ãC.

In automotive electronics, it supports advanced driver assistance systems (ADAS) by providing robust performance under varying environmental conditions.

Industrial automation applications benefit from its ability to manage multiple I/O interfaces seamlessly, enhancing system reliability and efficiency.

Medical devices utilize its precision timing capabilities for critical life-support functions.

Its versatility makes it suitable for embedded systems requiring high computational power and low power consumption.

Key Advantages

1. Operating speed up to 600 MHz, enabling rapid processing of large datasets.

2. Advanced memory management features that optimize data access patterns.

3. Low power consumption, reducing operational costs and extending battery life in portable devices.

4. Compliance with various industry standards such as ISO 9001 and CE marking.

Frequently Asked Questions

Q1: Can the XC2S600E-6FGG456C be used in environments with extreme temperatures?

A1: Yes, it operates effectively within a wide temperature range of -40¡ãC to +85¡ãC, making it suitable for both industrial and outdoor applications.

Q2: What are the specific memory configurations available for this device?

A2: The XC2S600E-6FGG456C offers flexible memory options including SRAM and Flash, allowing customization according to application needs.

Q3: How does this chip ensure data security in sensitive applications?

A3: It includes hardware-based encryption engines and secure boot mechanisms to protect against unauthorized access and tampering.

Other people’s search terms

– High-speed digital signal processor

– Automotive electronics components

– Industrial automation processors

– Medical device microcontrollers

– Embedded system solutions

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
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Global Logistics
Global logistics are available for delivery
B2B Sales
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24/7 Support
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