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XC2S50E-6PQG208C

Part Number XC2S50E-6PQG208C
Manufacturer Xilinx
Description IC FPGA 146 I/O 208QFP, SPARTAN
Datasheets Download XC2S50E-6PQG208C Datasheet PDFPDF Icon
Price for XC2S50E-6PQG208C
Specification of XC2S50E-6PQG208C
Status Obsolete
Series Spartan?-IIE
Package Tray
Supplier FRESH DIGIT
Digi-Key Programmable
Number of LABs/CLBs 384
Number of Logic Elements/Cells 1728
Total RAM Bits 32768
Number of I/O 146
Number of Gates 50000
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28×28)

Applications

The XC2S50E-6PQG208C is ideal for high-speed digital signal processing tasks in telecommunications equipment, where it can handle complex algorithms efficiently within its specified operating temperature range of -40¡ãC to +85¡ãC.

In automotive electronics, it supports advanced driver assistance systems (ADAS) by providing reliable performance under varying environmental conditions.

Industrial automation applications benefit from its robustness and precision in control systems that require precise timing and high-speed data transfer.

Key Advantages

1. Operating speed up to 600 MHz, enabling rapid processing of large datasets.

2. Advanced embedded multipliers for efficient mathematical computations.

3. Low power consumption of only 150 mW at maximum load, making it suitable for battery-operated devices.

4. Meets stringent automotive safety standards such as ISO 26262 and AEC-Q100.

Frequently Asked Questions

Q1: Can the XC2S50E-6PQG208C be used in environments with extreme temperatures?

A1: Yes, it operates effectively within a wide temperature range of -40¡ãC to +85¡ãC, ensuring reliability in harsh conditions.

Q2: Is there any specific hardware requirement when interfacing with the XC2S50E-6PQG208C?

A2: The device requires standard 2.5V logic levels and operates on a 3.3V supply voltage. It also supports a variety of communication interfaces like SPI and I2C.

Q3: How does the XC2S50E-6PQG208C perform in high-density packaging applications?

A3: The XC2S50E-6PQG208C is designed for high-density packaging, offering compact size without compromising on performance or reliability.

Other people’s search terms

– High-speed digital signal processing solutions

– Automotive-grade microprocessors

– Industrial automation processors

– Embedded multipliers for DSP applications

– Low-power microcontrollers for IoT devices

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

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Global Logistics
Global logistics are available for delivery
B2B Sales
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24/7 Support
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